| 摘要 |
<p>Contact bump construction ( 27 ) and method for the production of a contact bump construction for the formation of elevated contact sites on connecting surfaces ( 22 ) of a substrate ( 21 ), particularly chip connecting surfaces, with a spacer metallization ( 28 ) for the attainment of a defined height of the contact bump construction, wherein the spacer metallization ( 28 ) consists at least partly of annealed copper.</p> |
