| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of forming an image by UV exposure and development with a dilute aqueous alkali solution, having no tackiness to a film for exposure in which a pattern image is formed, capable of giving a pattern excellent in adhesion, electric insulating property, resistance to the heat of soldering and chemical resistance, and suitable for use as a solder resist for production of a printed wiring board. <P>SOLUTION: The photosensitive resin composition comprises a photosensitive vinyl copolymer modified resin (A) obtained by adding a specified epoxy compound to part of the carboxyl groups of a carboxylic copolymer resin synthesized from (meth)acrylic acid and a (meth)acrylic ester or a carboxylic copolymer resin synthesized from (meth)acrylic acid, a (meth)acrylic ester and a styrene derivative, a photosensitive resin (B) having at least two ethylenically unsaturated bonds per molecule, a reactive diluent (C), a photopolymerization initiator (D) and a thermosetting compound (E). <P>COPYRIGHT: (C)2004,JPO |
