METHOD FOR MANUFACTURING COPPER FOIL/RESIN LAMINATE

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a copper foil/resin laminate by which the release strength between a copper foil and a resin can be sufficiently increased.

SOLUTION: This method for manufacturing a copper foil/resin laminate comprises the corona discharge step to perform a corona discharge to an electrodeposited copper layer of the copper foil having the electrodeposited copper layer and the deposition step to deposit a hydrolyzable silicon compound on the surface of the electrodeposited copper layer subjected to the corona discharge process and obtain the surface-treated copper foil and the adhesion step to bond the surface-treated copper foil to the resin, using an adhesive face on which the hydrolyzable silicon compound is deposited.

COPYRIGHT: (C)2004,JPO