发明名称 LEAD FRAME
摘要 <p>PURPOSE:To improve productivity and solderability in a lead frame supported in cooperation of leads with an outer frame by so forming burrs formed by pressing at a lead group region as to be directed toward opposite side to a land contact face of the lead. CONSTITUTION:When a multi-lead frame 1 is so arranged that the main face of a film 10 is directed upward, burrs 11 of outer frames 3, 3 are directed upward, and burrs 11 of a lead group region A are directed downward. Since a recess 15 is so submerged at the center of a feeder 14, i.e., at a region opposite to the region A as to escape the burrs 11 protruded downward, the frame 1 is slidably contacted with the surface of the feeder 14 at the frames 3, 3 at both ends. Since the burrs 11 of the frame 3 are directed upward, the burrs 11 are not engaged with the surface of the feeder 14. Accordingly, an accident of improperly bending the leads or stopping a conveyance of a feeder can be avoided in advance.</p>
申请公布号 JPS641265(A) 申请公布日期 1989.01.05
申请号 JP19870155451 申请日期 1987.06.24
申请人 HITACHI LTD 发明人 ARAI SHIGERU;IIZAKA SUSUMU;NAKAJIMA MIHARU;NAKAMURA JUNICHI
分类号 H01L23/48 主分类号 H01L23/48
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