发明名称 HIGH-FREQUENCY DEVICE
摘要 PROBLEM TO BE SOLVED: To connect two pieces of high-frequency circuit boards without increasing line losses, while ensuring reliability. SOLUTION: A high-frequency device comprises a first circuit board on which a first strip line for transmitting high-frequency signals and a through-hole electrodes connected to the first strip line are formed, a first element mounted on the first circuit board and connoted to the first strip line, a second circuit board, which is placed almost normally to the first circuit board, on which side electrodes are formed at positions opposite to the through-hole electrodes on an end face opposite to the first circuit board and which has a second strip line for transmitting the high-frequency signals and being connected to the side electrodes; and a second element mounted on the second circuit board and connected to the second strip line. The first circuit board and the second circuit board, placed almost normal to the first circuit board, are jointed by molten junction members connecting the through hole electrodes to the side electrodes. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003289202(A) 申请公布日期 2003.10.10
申请号 JP20020090485 申请日期 2002.03.28
申请人 MITSUBISHI ELECTRIC CORP 发明人 KAWASHIMA YASUO;KITAMURA YOICHI;FUJINO JUNJI;TAKAGI SUNAO;TAKEUCHI NORIO
分类号 H01P1/04;H01P5/02;H01P11/00;(IPC1-7):H01P1/04 主分类号 H01P1/04
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