| 发明名称 |
SUBSTRATE FOR ELECTRONIC PART, MANUFACTURING METHOD THEREFOR AND ELECTRONIC PART |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a ceramic substrate constituting a chip resistor that can be mounted on a circuit board with both front back surfaces on a circuit board. <P>SOLUTION: Peripheries of a number of dividing grooves formed on a multipiece-forming ceramic substrate is raised. <P>COPYRIGHT: (C)2004,JPO</p> |
| 申请公布号 |
JP2003289002(A) |
申请公布日期 |
2003.10.10 |
| 申请号 |
JP20020090551 |
申请日期 |
2002.03.28 |
| 申请人 |
KOA CORP |
发明人 |
TANAKA KIYOSHI |
| 分类号 |
H01C17/06;H01C7/00;(IPC1-7):H01C17/06 |
主分类号 |
H01C17/06 |
| 代理机构 |
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