| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing semiconductors which enables carrying out sealing molding by transfer molding with no fear of coating an outer contact terminal on the surface of a substrate with a resin flowing out of an air vent. SOLUTION: The epoxy resin composition for sealing semiconductors comprises an epoxy resin, a curing agent, an inorganic filler, and a curing accelerator as the essential components, and is used for effecting sealing molding of a semiconductor element on a single side of a substrate 2 on which a semiconductor element is mounted by transfer molding. The length for the resin composition to flow out of the air vent 20 having a width of 0.75 mm and a thickness of 0.03 mm formed in a transfer mold 13 in transfer molding is≤1 mm and, simultaneously, the gel time at 170°C is 8-30 sec. COPYRIGHT: (C)2004,JPO |
