| 摘要 |
PROBLEM TO BE SOLVED: To provide a flame-retardant epoxy resin composition which has high flame retardancy with neither a halogen compound nor a phosphorus- containing flame retardant, is improved in flowability, and does not deteriorate the characteristics of a product, and a semiconductor sealing material made by using it. SOLUTION: The epoxy resin composition comprises essentially an epoxy resin having at least two epoxy groups in the molecule, a curing agent, and a compound wherein a metal atom is bonded to a carboxylic acid compound through an ionic or coordinate bond. COPYRIGHT: (C)2004,JPO
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