发明名称 Specific bonding analysis method and device therefor
摘要 A specific bonding analysis method by which sensitivity and concentration range in analysis can be freely set, and a device using this are provided. The intended analysis is optimized by using a specific bonding analysis device capable of controlling the velocity of a sample passing through a detection part and causing no remaining of unnecessary components on a detection part.
申请公布号 US2003190759(A1) 申请公布日期 2003.10.09
申请号 US20030404563 申请日期 2003.04.02
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 KAWAMURA TATSUROU
分类号 G01N33/543;G01N37/00;(IPC1-7):G01N33/558;G01N33/551 主分类号 G01N33/543
代理机构 代理人
主权项
地址