发明名称 |
PARTING METHOD FOR FRAGILE MATERIAL SUBSTRATE AND PARTING DEVICE USING THE METHOD |
摘要 |
<p>A parting method for a fragile material substrate and a parting device using the method, the parting method comprising a scribe step for scribing the fragile material substrate in such a state that a protective member is applied onto one surface of the substrate; the parting device comprising a first scribing device for performing the scribe step, whereby cullet produced when the substrate is parted can be effectively removed, and the substrate can be accurately parted along a scribe line by forming a vertical crack extending deep into the substrate.</p> |
申请公布号 |
WO03082542(A1) |
申请公布日期 |
2003.10.09 |
申请号 |
WO2003JP04159 |
申请日期 |
2003.04.01 |
申请人 |
MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD.;MAEKAWA, KAZUYA;SOYAMA, HIROSHI |
发明人 |
MAEKAWA, KAZUYA;SOYAMA, HIROSHI |
分类号 |
B28D5/00;C03B33/033;C03B33/07;C03B33/10;(IPC1-7):B28D5/00;C03B33/023 |
主分类号 |
B28D5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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