发明名称 PARTING METHOD FOR FRAGILE MATERIAL SUBSTRATE AND PARTING DEVICE USING THE METHOD
摘要 <p>A parting method for a fragile material substrate and a parting device using the method, the parting method comprising a scribe step for scribing the fragile material substrate in such a state that a protective member is applied onto one surface of the substrate; the parting device comprising a first scribing device for performing the scribe step, whereby cullet produced when the substrate is parted can be effectively removed, and the substrate can be accurately parted along a scribe line by forming a vertical crack extending deep into the substrate.</p>
申请公布号 WO03082542(A1) 申请公布日期 2003.10.09
申请号 WO2003JP04159 申请日期 2003.04.01
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD.;MAEKAWA, KAZUYA;SOYAMA, HIROSHI 发明人 MAEKAWA, KAZUYA;SOYAMA, HIROSHI
分类号 B28D5/00;C03B33/033;C03B33/07;C03B33/10;(IPC1-7):B28D5/00;C03B33/023 主分类号 B28D5/00
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