发明名称 |
Method for post-CMP conversion of a hydrophobic surface of a low-k dielectric layer to a hydrophilic surface |
摘要 |
A method of converting a hydrophobic surface of a dielectric layer to a hydrophilic surface is described. That method comprises forming on a substrate a dielectric layer that has a hydrophobic surface, then coupling a hydrophilic component to the surface of the dielectric layer. Also described is a method for making a semiconductor device that employs this technique after polishing a conductive layer, which may comprise copper.
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申请公布号 |
US2003190816(A1) |
申请公布日期 |
2003.10.09 |
申请号 |
US20020119805 |
申请日期 |
2002.04.09 |
申请人 |
BUEHLER MARK F.;FREDRICKSON LARRY R. |
发明人 |
BUEHLER MARK F.;FREDRICKSON LARRY R. |
分类号 |
C11D3/00;C11D7/26;C11D11/00;H01L21/02;H01L21/3105;H01L21/321;H01L21/768;(IPC1-7):H01L21/31 |
主分类号 |
C11D3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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