发明名称 Multi-level flash memory with temperature compensation
摘要 A multi-level semiconductor memory device preferably includes a plurality of wordlines connected to memory cells configured to store multi-level data. A first circuit supplies a temperature-responsive voltage to a selected wordline in order to read a state of a selected memory cell. A second circuit supplies a predetermined voltage to non-selected wordlines. The first circuit preferably includes a semiconductor element that varies its resistance in accordance with temperature. Reliable program-verifying and reading functions are preferably provided despite migration of threshold voltage distribution profiles due to temperature variations.
申请公布号 US2003189856(A1) 申请公布日期 2003.10.09
申请号 US20020300485 申请日期 2002.11.19
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHO TAE-HEE;LEE YEONG-TAEK
分类号 G11C8/08;G11C11/56;G11C16/02;G11C16/04;G11C16/06;(IPC1-7):G11C11/34 主分类号 G11C8/08
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