RING TYPE CONTACTOR PAD OF INTEGRATED SILICONE CONTACTOR

摘要

Disclosed herein is a ring type contactor pad of an integrated silicone contactor. The integrated silicone contactor comprises a conductive silicone element which is located in a region being in contact with a ball lead of the BGA (Ball grid array) semiconductor device; and an insulating silicon element which is located in a region not in contact with the ball lead of the semiconductor device to support the conductive silicon element and serves as an insulation layer. According to the present invention, a ring-shaped conductive material made from, e.g., gold (Au) or platinum (Pd), is mounted on the upper surface of the conductive silicon element which connects a contact pad of a socket board that performs a semiconductor test with a lead of the semiconductor device.