| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing method and a polishing apparatus, which can easily and simultaneously carry out measurement of a total polished amount and detection of a terminal point though these items have been separately measured until now, and is provided with a function for giving information about a different kind of workpieces during polishing, and in addition, has a controllable attitude displacement gauge so as to perform the measurement of polished amount and the detection of the terminal point by means of each wafer, a top ring, and a polishing cloth. <P>SOLUTION: A position of a back surface of a workpiece 1 is measured by a non-contact displacement gauge 11 via a transparent window 18 provided on the top ring 2 in order to observe the back surface of the workpiece 1. <P>COPYRIGHT: (C)2004,JPO |
