| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining device capable of forming a large hole on an insulating layer and a metal layer on the insulating layer in a short time. <P>SOLUTION: A stage 20 holds a physical object for machining 21. A first laser radiation source 1 using a solid dielectric including an ion as a laser medium produces a double harmonic component of the fundamental wave which is emission-induced by the laser medium. A second laser radiation source 11 produces a laser beam in the infrared region. A first collector optics system condenses the laser beam emitted from the first laser radiation source on the physical object for machining held on the stage. A second collector optics system condenses the laser beam emitted from the second laser beam source on the physical object for machining 21 held on the stage 20. <P>COPYRIGHT: (C)2004,JPO</p> |
