| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus capable of holding a substrate to high flatness even when substrates different in size are treated. SOLUTION: This substrate treatment apparatus is equipped with a support stand 11 having a planar part formed to the upper surface thereof, on which the substrate W is placed, a plurality of support pins 13 piercing the support stand 11 to be raised and lowered by the driving a support pin lift mechanism 12, a support stand lift mechanism 14 for driving the support stand 11 to raise the lower the same, a resist coating nozzle 15 for applying a resist, a nozzle moving mechanism for moving the resist coating nozzle 15 in the direction parallel to one side of the substrate W and a pair of feed arms 51 for supporting the substrate W from the undersurface thereof to feed the same. The support stand 11 has a dimension substantially equal to or more than the maximum dimension of the rectangular substrate in both directions, that is, the moving direction of the resist coating nozzle 15 and the direction crossing the moving direction of the resist coating nozzle 15 at a right angle. COPYRIGHT: (C)2004,JPO |
