| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package for high frequency for which an inexpensive heat sink plate having a high heat radiating characteristic can be used and which can prevent the occurrence of warping, and to provide a power module substrate for high frequency. <P>SOLUTION: The package for high frequency has a ring-like frame body 12 bonded to the surface of the rectangular heat sink plate 11. The heat sink plate 11 is composed of a Cu or Cu-based metal plate having a high heat radiating characteristic and the ring-like frame body 12 is composed of a low- temperature baked ceramic having a large coefficient of thermal expansion. In addition, the heat sink plate 11 and ring-like frame body 12 are bonded to each other by the active metal method. Moreover, the low-temperature baked ceramic forming the ring-like frame body 12 has a coefficient of thermal expansion of ≥10×10<SP>-6</SP>/°C. <P>COPYRIGHT: (C)2004,JPO |
