| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce particles adhered to a rear surface of a wafer or the like, make a system simple and compact, suppress generation of particles as much as possible, and process the wafer or the like while it is positioned. <P>SOLUTION: A wafer W conveyed by a board conveyance means is received by a rotary supporting body 31, and the wafer W is turned in the horizontal direction together with the rotary supporting body 31 by a servo motor 32, and then a sensor 33 detects a notch on the periphery of the wafer W supported by the rotary supporting body 31 and stops the rotation of the wafer W. Then, an elevating supporting body 34 is elevated by an air cylinder 35, and it receives the wafer W from the rotary supporting body 31 and lifts it above the rotary supporting body 3I. In this state, after the rotary supporting body 31 is restored at an initial position before rotation, the elevating supporting body 34 is lowered and the wafer W is handed over the rotary supporting body 31. <P>COPYRIGHT: (C)2004,JPO</p> |
