发明名称 |
MULTI-LAYER FLEXIBLE PRINTED BOARD, LAMINATE STRUCTURE OF MULTI-LAYER FLAT CABLE, AND ELECTRIC CONNECTION BOX UTILIZING THE LAMINATE STRUCTURE |
摘要 |
PROBLEM TO BE SOLVED: To reduce a trouble in a flexible board comprising a multi-layer structure due to the rise of temperature. SOLUTION: A flexible printed board 1 of a multi-layer structure comprises a structure formed by overlapping FPCs 4a to 4d intervening a heat conductive member 5 therebetween. Heat produced on the circuit sections 3 of the FPCs 4a to 4d of the multi-layer FPC owing to power supply is dispersed to the FPCs 4a to 4d through the heat conductive member 5 to reduce the temperature rise of the whole of the circuit of the multi-layer FPC 1. COPYRIGHT: (C)2004,JPO |
申请公布号 |
JP2003283169(A) |
申请公布日期 |
2003.10.03 |
申请号 |
JP20020082822 |
申请日期 |
2002.03.25 |
申请人 |
FUJIKURA LTD |
发明人 |
SEO SUKEFUMI |
分类号 |
H05K7/20;H01B7/08;H05K3/46;(IPC1-7):H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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