| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component bonding device and a bonding method in which the pitch of electronic components to be bonded in parallel with the edge portion of a display panel may be changed freely. SOLUTION: A plurality of tools 41 for crimping electronic components 5 to the electrode of a display panel 1 are provided in parallel to a head portion 40, and the pitch of these tools 41 may be varied freely with feed screws 71a to 71d and nuts 70a to 70d engaged therewith. Therefore, the tools 41 may be moved in the horizontal direction by rotating the feed screws 71a to 71d depending on the size of pitch of the electronic components 5 to be bonded to the display panel 1. Accordingly, the pitch of the electronic components 5 may be varied by freely changing the pitch of the tools 41. COPYRIGHT: (C)2004,JPO
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