| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability of mounting and enable application of a printed board at a low cost by increasing a ball pitch or a ball size without being restricted by a package of an existing semiconductor integrated circuit, in an auxiliary package for wiring in which BGA (ball grid array) structure is adopted. SOLUTION: This auxiliary package for wiring is provided with internal circuit wiring and external terminal rows (balls) 7 having the BGA structure in a package. The BGA structure consists of a plurality of parts different in the ball pitch. A ball pitch P<SB>1</SB>in an outer peripheral part of the package is larger than a ball pitch P<SB>2</SB>in a package central part. A size D<SB>1</SB>of balls in the outer peripheral part of the package is larger than the sizes D<SB>2</SB>of the balls in the package central part. COPYRIGHT: (C)2004,JPO
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