发明名称 POLISHING MACHINE AND POLISHING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To improve the uniformity of a surface to be polished by eliminating selectively convex portions without degrading the quality or significant lowering of throughput. <P>SOLUTION: The polishing machine 1 for polishing the surface 22 to be polished by means of relative friction movement caused by contacts of polishing pads 11 with the surface 22 to be polished of a material (a substrate 21) to be polished, wherein there are provided a plurality of polishing pads 11, each of which is rotatable and defines the peripheral surface 12 thereof as a polishing surface. Thereby, polishing is performed by making the peripheral surface 12 of each polishing pad 11 in contact with a part of the surface 22 to be polished. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2003282493(A) 申请公布日期 2003.10.03
申请号 JP20020029108 申请日期 2002.02.06
申请人 SONY CORP 发明人 SHIBUKI SHUNICHI
分类号 B24B7/20;B24B37/00;B24B37/005;B24B37/04;B24B37/10;B24B53/00;B24B57/02;H01L21/304 主分类号 B24B7/20
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