发明名称 HOLLOW PACKAGE AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To protect a circuit element inside a package from outside by preventing a degradation in air tightness caused by a gap at a joint interface with a vessel body, by means of a lead member of a metal conductor penetrating the insulating vessel body constituting a hollow package. SOLUTION: A pair of lead members 11 an 12 of a hollow package 10 penetrate opposed side walls of an insulating vessel body 22 with a resin seal 20 interposed on the joint interface. An element 15 is built in by connecting between tip electrodes 13 and 14 of the lead members 11 and 12. An opening of the vessel body 22 is covered with an insulating cap material 24 for sealing. The resin seal 20 is formed by injecting an organic impregnant into an air gap 20x at the joint interface against the vessel body 22 through which the lead members 11 and 12 penetrate. Thus, air tightness between them is improved and the internal element 15 is prevented from being affected from outside, so intrinsic function of the element is fully exhibited. The resin seal 20 is formed, after the insulating vessel 22 is integrally molded with the lead members 11 and 12, by injecting and filling the organic impregnant of cross-link polymer whose main component is acrylic resin into a small gap at the interface where both bond together in an impregnation process with heat and vacuum, which is solidified in a work process. COPYRIGHT: (C)2004,JPO
申请公布号 JP2003281985(A) 申请公布日期 2003.10.03
申请号 JP20020082687 申请日期 2002.03.25
申请人 NEC SCHOTT COMPONENTS CORP 发明人 YOSHIKAWA TOKIHIRO
分类号 H01L23/04;H01H37/76;H01L23/08;H03H9/02;(IPC1-7):H01H37/76 主分类号 H01L23/04
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