| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board and its manufacturing method which enable electric connection of a through-hole without plating, and realize cost reduction and treating time reduction, 7 irrespective of a double-sided board and a multilayered laminate. SOLUTION: The manufacturing method of a printed wiring board has a process for electrically connecting a part between wiring patterns 9 formed on a surface and a back of an insulating substrate 31, via a through-hole 4. The substrate 31 is constituted of a multilayered laminate 30 having an inner layer wiring pattern 15. A process for electrically connecting a part between the wiring patterns 9 formed on the surface and the back of the laminate 30 is characterized by having a process for inserting a conductive member 11 made of a metal which is previously covered with solder 12 into the through- hole, after a process for forming the penetrating through-hole 4, and a process for fixing the conductive member to at least a through-hole land part by heating the solder 12 in the state that the conductive member is inserted into the through-hole. COPYRIGHT: (C)2004,JPO
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