| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology for bonding and securing micro particles of a target organic material onto the surface of a conductor of metal, or the like, in the shape of an extremely thin film. SOLUTION: In the method for forming a micro particle bonding film onto the surface of a conductor, the conductor serves as an electrode and micro particles are arranged, in film shape, on the surface of the conductor by applying an electric field thereto and then a pulsating electric field is further applied thereto. COPYRIGHT: (C)2004,JPO
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