| 摘要 |
A flexible interconnect structure (10) allows for rapid dissipation of heat generated from an electrical device that includes light-emitting elements (300), such as light-emitting diodes ("LEDs") and/or laser diodes. The flexible interconnect structure (10) comprises: (1) at least one flexible dielectric film (20) on which circuit traces (40) and, optionally, electrical circuit components (30, 32, 34, 36, 38) are formed and at least a portion of which is removed through its thickness; and (2) at least a heat sink (100) attached to one surface of the flexible dielectric film (20) opposite to the surface on which circuit traces (40) are formed. The flexible interconnect structure can include a plurality of such flexible dielectric films (20), each supporting circuit traces (40) and/or circuit components (30, 32, 34, 36, 38) and each being attached to another by an electrically insulating layer (70). Electrical devices or light sources having complex shapes are formed from such flexible interconnect structures and light-emitting elements (300) attached to the heat sinks (100) so to be in thermal contact therewith. |
