LEAD FRAME FOR SEMICONDUCTOR DEVICE

摘要

PURPOSE:To prevent warps or wrinkles from occurring in a film and cracks from occurring in a package even by application to a lead frame of a semiconductor device having a bus bar as nearly long as the film. CONSTITUTION:This lead frame is formed out of a plurality of inner leads 1 parallely arranged over a predetermined width, bus bars 2 located in front of the plurality of inner leads 1 and extending over a width larger than a predetermined one, and chip-mounting adhesive films 3 provided independently over the plurality of inner leads 1 and bus bars 2.