| 摘要 |
An electronic package for providing an increased density of electronic components in systems includes electronic components mounted on two surfaces of a substrate. Electrical coupling is provided by electrical contacts mounted with substantially the same arrangement and number on both surfaces of the substrate. Two conductive substrates having apertures are mounted adjacent and substantially parallel to the two component mounting surfaces such that the electrical contacts mounted on the two surfaces protrude through the apertures of the two conductive substrates. The two conductive substrates are coupled to one or more heat sinks to conduct heat away from the multiple electronic components contained between the conductive substrates. Multiple electronic packages can be coupled together to form a stacked electronic package by physically connecting the electrical contacts of the electronic packages.
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