| 摘要 |
<p>The invention concerns a method for transferring at least an element from a donor substrate to a target substrate (40). The invention is characterized in that it consists in securing the element to a handle-substrate via a bonding layer (32) capable of degradation and in producing a degradation of the bonding layer during a step which consists in releasing the element to be transferred. The invention is applicable to the transfer of components.</p> |
