| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a storage tray for an electronic component and the like, which allows a tray body to be structurally stout without being deformed, which allows, for example, the electronic components such as a semiconductor integrated circuit, an IC card, a substrate and a liquid crystal board to be appropriately stored and transported without contact, and which guarantees a reliable high-quality product with high accuracy. <P>SOLUTION: In this storage tray for the electronic component and the like, an outer leg 4 is provided in flange parts 2A, 2B, 2C and 2D and below outside around an outer edge of the tray body which is formed in an approximately dished shape, for example, by vacuum molding of a thermoplastic synthetic resin sheet; stacking protrusions 5, which are to be stacked on upper surfaces of the flange parts 2A, 2B, 2C and 2D of the tray body 1 for being arranged in a lower tier, are formed inside the leg part 4 from top surfaces I of the flange parts 2A, 2B, 2C and 2D; and vertical grooves 6 with a desired depth, which almost cross a plate surface of the leg part 4, are formed in the stacking protrusions 5 in a height direction Z between the top surfaces of the flange parts 2A, 2B, 2C and 2D and a lower part of the leg part 4, so that a width L1 of a front upper part 6a of the vertical groove 6 can be smaller in dimension than a thickness N of the stacking protrusion 5 and so that a width L2 of a front lower part 6b thereof can be greater than the width L1. <P>COPYRIGHT: (C)2004,JPO |
