发明名称 |
Heat sink for cooling a heat generating electronic circuit such as a central processing unit uses a number of wire loops to dissipate heat energy |
摘要 |
The heat sink element used to cool a computer CPU (3) or graphics card has a metal plate (2) in contact with the surface. Projecting from the plate are large number of thin wire loops (1) that serve to provide a large surface are for heat energy dissipation.
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申请公布号 |
DE20309460(U1) |
申请公布日期 |
2003.10.02 |
申请号 |
DE2003209460U |
申请日期 |
2003.06.18 |
申请人 |
FELLER, PAUL |
发明人 |
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分类号 |
H01L23/367;(IPC1-7):G06F1/20 |
主分类号 |
H01L23/367 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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