发明名称 Heat sink for cooling a heat generating electronic circuit such as a central processing unit uses a number of wire loops to dissipate heat energy
摘要 The heat sink element used to cool a computer CPU (3) or graphics card has a metal plate (2) in contact with the surface. Projecting from the plate are large number of thin wire loops (1) that serve to provide a large surface are for heat energy dissipation.
申请公布号 DE20309460(U1) 申请公布日期 2003.10.02
申请号 DE2003209460U 申请日期 2003.06.18
申请人 FELLER, PAUL 发明人
分类号 H01L23/367;(IPC1-7):G06F1/20 主分类号 H01L23/367
代理机构 代理人
主权项
地址