| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having good adhesiveness to a sealant put on a solder resist, a liquid sealant, an under filler, an anisotropic electrically conductive material, etc., and suitable for use as a high reliability solder resist composition for a package having TCT resistance, reflow cracking resistance and PCT resistance. <P>SOLUTION: In a photosensitive resin composition comprising a photosensitive resin (A) having carboxyl groups, an epoxy curing agent (B) and a photopolymerization initiator (C), the components are blended in such a way that the molar ratio of epoxy groups to carboxyl groups ranges from 1.1 to 1.5. <P>COPYRIGHT: (C)2004,JPO |
