| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for producing an epoxy resin substrate for carrying a LED bare chip, having better processability compared with a ceramic substrate, having high heat-releasing characteristics and whiteness in order to increase reflectance, and to provide a resin composition. <P>SOLUTION: The resin composition comprises an epoxy resin, a curing agent and an inorganic filler including a white-based pigment and has about 1-100 W/mK heat conductivity after curing of the resin composition. The method for producing the substrate has a first step for applying the resin composition to a conductive plate for forming a circuit, a heat-releasing plate or a supporting plate and a second step for curing the resin composition, and the second step has a primary curing step for curing the resin composition in a semi-cured state under 1-20 kPa press pressure by a heating press machine and a secondary curing step for heating and curing the treated resin in a heating atmosphere. <P>COPYRIGHT: (C)2004,JPO</p> |
