发明名称 HOLLOW STRUCTURE PLATE, MANUFACTURING METHOD THEREOF, MANUFACTURING DEVICE THEREOF, AND SOUND ABSORBING STRUCTURE PLATE
摘要 An introduction guide (12) is arranged above and beneath a sheet introduction opening of a pressure-reduced chamber (10) and heating means (17) is provided between the introduction guides, so that pressure is reduced and a resin sheet (3) is adsorbed to a circumferential surface of an emboss roller (11) by pressure reduction. Moreover, the emboss roller (11) has a pin (112) having a shape of a frustum of circular cone and a total bottom area which occupies 0.5 or more of the emboss roller circumferential surface. The rising angle of the pin side surface against the perpendicular surface including the center axis of the pin is in a range from 50 to 70 degrees. Furthermore, two thermoplastic resin sheets are attached to each other via their hollow protrusions (112) deposited together so as to constitute a core material. A non-air permeable sheet (130) is attached to the front and rear surfaces of the core material to obtain a layered hollow structure plate (140). A sound absorbing material (150) is provided on the front or rear surface of the plate. Small holes (114a) opening in the layered hollow structure plate are formed only at the position matched with a liner portion (114) and the liner portion (114) of the non-air permeable sheet (130).
申请公布号 WO03080326(A1) 申请公布日期 2003.10.02
申请号 WO2003JP03742 申请日期 2003.03.26
申请人 UBE-NITTO KASEI CO., LTD.;NAKAJIMA, MASAHIKO;MIYAZAKI, TAKESHI;ODA, TAKAYUKI;KOZUKA, KENJI 发明人 NAKAJIMA, MASAHIKO;MIYAZAKI, TAKESHI;ODA, TAKAYUKI;KOZUKA, KENJI
分类号 B29C51/02;B29C51/22;B29C51/26;B29C65/02;B29C69/00;B29D24/00;B32B3/12;B32B3/28;E04B1/84;E04C2/20;E04C2/34;G10K11/172 主分类号 B29C51/02
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