发明名称 |
Optimized heat sink using high thermal conducting base and low thermal conducting fins |
摘要 |
An optimized design for a composite heat sink is provided utilizing a high thermal conducting base and low thermal conducting fins. The base preferably is constructed from anisotropic graphite material, and the fins are preferably constructed from a thermally conductive plastic material. In the case of a low profile heat sink having a fin height of no greater than about 15 mm, the composite construction provides superior cooling yet lighter weight as compared to a conventional all-aluminum heat sink of the same dimensions.
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申请公布号 |
US2003183379(A1) |
申请公布日期 |
2003.10.02 |
申请号 |
US20020113381 |
申请日期 |
2002.03.29 |
申请人 |
KRASSOWSKI DANIEL W.;CHEN GARY G. |
发明人 |
KRASSOWSKI DANIEL W.;CHEN GARY G. |
分类号 |
F28F3/02;F28F21/06;H01L23/367;H01L23/373;(IPC1-7):F28F7/00 |
主分类号 |
F28F3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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