发明名称 Optimized heat sink using high thermal conducting base and low thermal conducting fins
摘要 An optimized design for a composite heat sink is provided utilizing a high thermal conducting base and low thermal conducting fins. The base preferably is constructed from anisotropic graphite material, and the fins are preferably constructed from a thermally conductive plastic material. In the case of a low profile heat sink having a fin height of no greater than about 15 mm, the composite construction provides superior cooling yet lighter weight as compared to a conventional all-aluminum heat sink of the same dimensions.
申请公布号 US2003183379(A1) 申请公布日期 2003.10.02
申请号 US20020113381 申请日期 2002.03.29
申请人 KRASSOWSKI DANIEL W.;CHEN GARY G. 发明人 KRASSOWSKI DANIEL W.;CHEN GARY G.
分类号 F28F3/02;F28F21/06;H01L23/367;H01L23/373;(IPC1-7):F28F7/00 主分类号 F28F3/02
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