VERFAHREN ZUR HERSTELLUNG VON ELEKTRONISCHEN MODULEN MIT AUF EINER LEITERPLATTE LÖTBAREN INTEGRIERTEN KUGEL- ODER FORMKÖRPERVERBINDERN UND VORRICHTUNG ZUR DURCHFÜHRUNG DES VERFAHRENS

摘要

The invention concerns a method for producing electronic modules with ball connector ( 7 ) or integrated preforms capable of being soldered on a printed circuit ( 3 ) and a device for implementing said method. The invention concerns a method for producing electronic modules in the form of ball housings combining a ball grid array ( 7 ) or geometrically identical preforms for interconnecting or shielding and surface-mounted components ( 2 ) on the same surface of a substrate ( 1 ), thereby enabling said module to be directly connectable by soldering on a printed circuit ( 3 ). The balls ( 7 ) and the components ( 2 ) are transferred in one single step onto the substrate ( 1 ) by means of a gripping device adapted to the topography of the module to be produced.