| 发明名称 |
POWER ELECTRONICS COMPONENT WITH IMPROVED THERMAL PROPERTIES |
| 摘要 |
<p>A power electronics component having a housing a cover plate and an electrically active region. The electrically active region is disposed in the housing in such manner that a gap exists between the electrically active region and the inner wall of the housing. The gap is filled with a moisture absorbent bulk granular material.</p> |
| 申请公布号 |
EP1173859(B1) |
申请公布日期 |
2003.10.01 |
| 申请号 |
EP20000929283 |
申请日期 |
2000.04.07 |
| 申请人 |
EPCOS AG |
发明人 |
VETTER, HARALD |
| 分类号 |
H01G4/224;H01G2/12;H01L23/00;H01L23/373;H01L23/42;(IPC1-7):H01G2/08;H01G2/02 |
主分类号 |
H01G4/224 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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