METHOD FOR MANUFACTURING FLIP CHIP

摘要

PURPOSE: A method for manufacturing a flip chip is provided to be capable of minimizing the failure rate of the flip chip by testing a plurality of electrical characteristics while manufacturing the flip chip. CONSTITUTION: After preparing a PCB(Printed Circuit Board), the first semiconductor circuit chip is loaded at the rear surface of the PCB(4S1). A plurality of electronic devices are loaded at the partial portion of the front surface of the PCB(4S3). At least one second semiconductor circuit chip is loaded at the front surface of the PCB(4S4). A plurality of conductive balls are attached at the peripheral portion of the rear surface of the PCB(4S5). A heat sink is attached at the upper portion of the second semiconductor circuit chip for releasing the heat generated from the resultant structure(4S6). An inspecting process is carried out for detecting electrical failure while manufacturing a flip chip(4S2,4S7,4S8).