| 摘要 |
PURPOSE: Provided are an adhesive composition and an adhesive tape containing the adhesive composition, which has high Tg and heat-resistance, a proper tensile strength in TAB(tape automated bonding) tape processing and wire bonding, and enough adhesive force under high temperature and humidity treatment(PCT) condition. CONSTITUTION: The adhesive composition contains: a polyamide resin having an amine value of 1-20 and a weight average molecular weight of 50,000-500,000; a polyamide resin having an amine value of 20-50 and a weight average molecular weight of 5,000-10,000; a resole type phenol resin having at least two methylol groups in the skeleton. And the adhesive tape contains an organic insulating film, an adhesive layer made of the adhesive composition, and a protection film.
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