发明名称 |
Method of measuring the concentration of a leveler in a plating liquid |
摘要 |
The concentration of a leveler in a plating liquid that is used by a plating apparatus for filling metal such as copper in interconnection trenches and holes defined in the surface of a semiconductor substrate or the like is determined based on a peak area (Ar value) in a peel-off region of the plating liquid measured according to a CV or CVS process.
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申请公布号 |
US6627066(B1) |
申请公布日期 |
2003.09.30 |
申请号 |
US20010830407 |
申请日期 |
2001.04.27 |
申请人 |
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发明人 |
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分类号 |
C25D21/12;C25D21/14;(IPC1-7):G01N27/42 |
主分类号 |
C25D21/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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