发明名称 LASER BEAM MACHINING METHOD AND LASER BEAM MACHINING APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To form an opening effectively in a short time on a covering layer of an object to be worked. <P>SOLUTION: The object to be worked including a base member which has a surface layer of a first material, a covering layer formed in a part of the surface of the base member by using a second material different from the first material and an adhesive layer which is adhered closely to at least part of the surface of the covering layer is prepared. A laser beam has a property of transmitting through the adhesive layer and the covering layer, reflected by the surface of the base member and peeling the covering layer of a reflecting position off the base member. The laser beam is made incident on the object to be worked from the surface of the adhesive layer and part of the covering layer is peeled off the base member. The adhesive layer is separated from the covering layer and the part of the covering layer peeled off the base member is removed from the object to be worked together with the adhesive layer. <P>COPYRIGHT: (C)2003,JPO</p>
申请公布号 JP2003275886(A) 申请公布日期 2003.09.30
申请号 JP20020080632 申请日期 2002.03.22
申请人 SUMITOMO HEAVY IND LTD 发明人 WAKABAYASHI NAOKI;HAYASHI KENICHI
分类号 B23K26/00;B23K26/38;B23K101/42;H05K3/00;(IPC1-7):B23K26/00 主分类号 B23K26/00
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