Radio frequency module parts including surface acoustic wave elements and manufacturing method thereof

摘要

The surface acoustic wave elements and the other surface mounting elements are mounted on a ceramic multi-layer substrate. The surface acoustic wave elements may be flip chips face-down-bonded to the gold coated mounting electrodes of the multi-layer ceramic substrate by gold-to-gold bonding. At least the surface acoustic wave elements are covered as sealed airtight with the side walls fixed to the multi-layer ceramic substrate and a cover closing the opening of the side walls.