| 发明名称 |
System and method for reinforcing a bond pad |
| 摘要 |
A reinforcing system for a bond which includes at least one dielectric layer or stack disposed under the bond pad. A reinforcing patterned structure is disposed in the dielectric layer or stack with the delectric filling the portion of the patterned structure from which the structure was removed after patterning.
|
| 申请公布号 |
US6625882(B1) |
申请公布日期 |
2003.09.30 |
| 申请号 |
US19990248303 |
申请日期 |
1999.02.11 |
| 申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
SARAN MUKUL;MARTIN CHARLES A. |
| 分类号 |
H01L21/60;H01L23/485;H05K1/02;H05K1/11;(IPC1-7):H01R9/00 |
主分类号 |
H01L21/60 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
