发明名称 |
Patterning three dimensional structures |
摘要 |
The invention is directed to a method of forming a three dimensional circuit including introducing a three dimensional circuit over a substrate. In one embodiment, the three dimensional circuit includes a circuit structure in a stacked configuration between a first signal line and a second signal line, where the two signal lines comprise similar materials. The method includes selectively patterning the second signal line material and the circuit without patterning the first signal line. One way the second signal line is patterned without patterning the first signal line is by modifying the etch chemistry. A second way the second signal line is patterned without patterning the first signal line is by including an etch stop between the first signal line and the second signal line. The invention is also directed at targeting a desired edge angle of a stacked circuit structure. In terms of patterning techniques, a desired edge angle is targeted by modifying, for example, the etch chemistry from one that is generally anisotropic to one that has a horizontal component to achieve an edge angle that is slightly re-entrant (i.e., having negative slope).
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申请公布号 |
US6627530(B2) |
申请公布日期 |
2003.09.30 |
申请号 |
US20000746204 |
申请日期 |
2000.12.22 |
申请人 |
MATRIX SEMICONDUCTOR, INC. |
发明人 |
LI CALVIN K.;KNALL N. JOHAN;VYVODA MICHAEL A.;CLEEVES JAMES M.;SUBRAMANIAN VIVEK |
分类号 |
H01L21/265;H01L21/3213;H01L21/4763;H01L21/77;H01L21/822;H01L21/84;H01L23/48;H01L23/52;H01L27/06;H01L27/12;H01L29/00;H01L29/40;(IPC1-7):H01L21/476 |
主分类号 |
H01L21/265 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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