| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device which improves manufacturing efficiency and reduces manufacturing costs by reducing the number of processes in forming an electrode structure, improves the degree of freedom in designing, and ensures solidity; a semiconductor device manufactured by the method; and a circuit board and an electronic apparatus provided with the semiconductor device. SOLUTION: An opening is formed in a passivation film 18 followed by forming an opening in an electrode pad 16. Thereafter, a hole H3 is formed in a substrate 10 through the passivation film 18 that serves as a mask. COPYRIGHT: (C)2003,JPO
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