| 摘要 |
PROBLEM TO BE SOLVED: To improve a covering property at succeeding process by controlling the unevenness of the processing of a rib-pattern, namely, uneven shape of the rib-pattern edge and a rib taper, caused by the difference of reflectivity of a semiconductor substrate, generated when forming a rib film at a photo process. SOLUTION: The reflectivity of the surface of the substrate is made uniform by using a reflection preventing film. The reflection preventing film is patterned and formed into a rib layer of the double layer structure together with a photosensitive organic film to be formed at the succeeding process. By the above, the process of forming the photosensitive organic film to be turned into a rib layer is stabilized, and a short circuit between upper and lower electrodes generated when forming the organic EL layer of the upper layer, and defective coverage of the upper layer film are prevented, and the reliability of the organic EL element is improved. COPYRIGHT: (C)2003,JPO
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