发明名称 DIE FOR GAME WITH MEMORY CHIPS BUILT IN
摘要 PURPOSE: A die for game with memory chips built in is provided to make it possible to detect the precise surface of die with the help of the antenna wire and the memory chips and to enhance the sensing function on the arrival spot with broad detection band. CONSTITUTION: The die for game with memory chip built in includes a concave part(2,2') on each surface of the polyhedral die(1); memory chips(3,3') and antenna wire(4,4') connected to memory chips(3,3') on the concave part(2,2'); and finishing plates(5,5') with different letters and symbols marked on each concave part(2,2') where memory chips(3,3') and antenna wire(4,4') are built in.
申请公布号 KR20030075816(A) 申请公布日期 2003.09.26
申请号 KR20020015274 申请日期 2002.03.21
申请人 KIM, YOUNG HO 发明人 KIM, YOUNG HO
分类号 A63F9/04;(IPC1-7):A63F9/04 主分类号 A63F9/04
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