| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermal conduction substrate that can fill an inorganic filler with high concentration, furthermore, enables a thermal conduction module to be manufactured by a simple method, and has the thermal coefficient of expansion in the plane direction of the substrate close to that of a semiconductor and has high heat radiation properties. SOLUTION: The thermal conduction substrate has a mixture sheet (500), a first wiring pattern (503) provided on one surface of the mixture sheet, a second wiring pattern (503) provided on the other, and a via hole (501) that is provided on the mixture sheet and is electrically connected to the first and second wiring patterns. In this case, the mixture sheet (500) includes the inorganic filler 70 to 95 pts.wt, and thermosetting resin compounds 5 to 30 pts.wt. The thermal coefficient of expansion and thermal conductivity are 8 to 20 ppm/°C and 1 to 10 W/mK, respectively, in the mixture sheet. COPYRIGHT: (C)2003,JPO |
