Process for coating thermoplastic substrates with a coating composition containing a non-aggressive solvent

摘要

A process for coating a thermoplastic substrate comprises applying a solvent based coating composition to the substrate and curing the coating composition at ambient temperature to 125oC to form a uniform smooth film on the substrate. The coating composition comprises 45-80% by weight of a film forming binder and 20-55% by weight of an organic liquid carrier. The binder consists of: (A) 40-90% by weight, based on the weight of the binder, of a polymer consisting of acrylic polyol, polyester polyol, polyether polyol or a polyurethane polyol; and (B) 10-60% by weight, based on the weight of the binder, of an organic polyisocyanate crosslinking agent. The organic liquid carrier used in the coating composition consists of at least 50% by weight, based on the weight of the organic liquid carrier used in the coating composition, of tertiary butyl acetate and up to 50% by weight, based on the weight of the organic liquid carrier, of other compatible organic solvent.