| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor circuit device capable of being accurately and efficiently inspected. SOLUTION: In the semiconductor circuit device, a plurality of semiconductor circuit devices 1a and 1b, etc., are formed on a wafer. Each semiconductor circuit device 1a and 1b, etc., is provided with a coil 11 for communication on the circuit, and the coil 11 for the communication is electrically connected to an additional circuit 2 for shortening a communication distance. The additional circuit 2 is arranged on a scribe line and is scribed off together with a part of the scribe line of the wafer at the time of cutting and separating the semiconductor circuit devices 1a and 1b, etc. COPYRIGHT: (C)2003,JPO
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